Main Features:
1. With reflow function,can meet requirement of IS0-9000 solder flux reflow.
2. With high quality heating material, temperature and time digitally displayed, controlling temperature stably.
3. Multiply security system ensures the safety operation.
4. Aluminum alloy board, heating from the bottom, stable, with little surge; eliminated hurt to BGA chip.
5. Be able to solder BGA chip of different specifications in the same time.
Operation steps
1.Open equipment power switch, settemperature parameters on C10 temperature controller,(weld lead solderball,220°-240°/lead free solderball,245°-265°.
2. Use soldering iron to clean pads of bga and PCB, use solder wick to drag pad.
3.Use the special cleaner or industrial alcohol cleaning flux residues.
4.On pad surfaces of BGA, PCB, coated with a small amount of aid solder paste evenly daub, ensure to binding and help of welding effect.
5.Choose solder ball corresponding with bga chip, when welding machines shows actual temperature and set temperature keep same, put BGA chip that finish reballing on high temperature resistant cloth, then put them on the left heating plate, set corresponding time, then press the start button to heate.
6. Observe whether tin ball trends and pad keep correspond.
7. When keep correspond, then put bga chip on the right cooling plate.
8. After solder ball cooling, if there is burr on the surface of Solder ball, wipe flux paste on solder ball, heating again will be better.
9. Take away bga chip that finish reballing process, and then turn off power.
Specification
1、 Heating Board Dimension: 120mm*200mm
2、 Power used: 600W
3、 Temperature settings: Room temperature~300℃, PID thermocouple.
4、 Alarm time:0.1-9.9 minutes.
5、 Voltage:AC220V.
6、 Machine dimension: L310mm*W280mm*H145mm
7、 G.W.:7.8 KG
8、 Package dimension: L370*H360*H220mm.
This website uses cookies (Learn more) and has a privacy policy (Learn more).